characteristics of epig deposits for fine-line applications continues
Figure 8: IMC observation and analysis of IMC composition by EDS with LF35; EPIG (Pd 0.1 µm,
Au 0.1 µm) and ENEPIG (Ni-P 6 µm, Pd 0.1 µm, Au 0.1 µm) as plated.
Figure 9: IMC observation and analysis of IMC composition by EDS with LF35; EPIG (Pd 0.1 µm,
Au 0.1 µm) and ENEPIG (Ni-P 6 µm, Pd 0.1 µm, Au 0.1 µm) after heat treatment.
20
The PCB Magazine • January 2014
