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characteristics of epig deposits for fine-line applications continues 12 while the results after heat treatment were shown in Figure 11 and Figure 13. For the as-plated samples, wire pull test results of EPIG were not related to Pd deposit thickness, but became better a little as Au thickness increased. For the sample after heat treatment for 16 hours at 175°C, wire pull results of EPIG film became worse, especially when Pd thickness was thinner. Also, the tendency was obvious that EPIG deposits with thicker Au had better WBR even if there was heat treatment. On the other hand, when both Au and Pd thicknesses were thinner, ENEPIG film had better WBR even if there was heat treatment, compared with EPIG film. For EPIG and ENEPIG deposits with Au Figure 10: Wire pull test results; EPIG (Pd 0.05–0.3 µm, Au 0.05–0.3 µm) as-plated. Figure 11: Wire pull test results; EPIG (Pd 0.05–0.3 µm, Au 0.05–0.3 µm) after heat treatment. 22 The PCB Magazine • January 2014