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characteristics of epig deposits for fine-line applications continues er, no peak of Cu was detected when Pd thickness was thicker. Therefore, thicker Pd film was effective to prevent Cu diffusion to Au surface. And also the peak of Pd with thicker Au layer was weaker than that with thinner Au layer. From the results of depth profile, the ratio of Pd in Au layer with thicker Au layer was lower than that with thinner Au layer. The ratio of Pd and Au intensity for the depth profile was plotted for every Pd and Au thickness as shown in Figure 18. The value of Au and Pd intensity used in this figure was that Figure 16: Wide scan results by AES; EPIG (Pd 0.05–0.30 µm, Au 0.05–0.30 µm) with heat treatment. Figure 17: Depth profile results by AES; EPIG (Pd 0.05–0.30 µm, Au 0.05–0.30 µm) with heat treatment. 26 The PCB Magazine • January 2014