104 SMT Magazine • March 2014
SmTonline Supplier/New Product
News highlights
i3 Electronics: $7m contract for
hyperBGa assemblies
i3 electronics Inc. announced that an industry lead-
ing computing & hardware firm has awarded the
company a $7 million contract for the supply of
i3's hyperbga assemblies. The contract will run
through Q4 of 2014.
Tera-Barrier Films Invents
alternative Stretchable Plastic
Tera-barrier films invents alternative stretchable
plastic for prolonging shelf-life of pharmaceuticals,
food, and electronics.
Indium Intros New Solder
Paste Technology
The company announced biagX, a high-melting,
lead-free solder paste technology designed for
high-reliability electronics assembly applications.
Designed as a drop-in replacement for standard
high lead-containing solder pastes, it has passed
MSl1 and thermal cycle testing at several power
semiconductor customers.
BEST Introduces New Plastic Film Stencils
The company has developed a line of Kapton SMT
stencils for the prototype assembly market. These
stencils, available in 4-, 5-, and 6-mil thicknesses,
present very flat coplanar printing surfaces for sol-
der paste printing and are designed to be used
when there are very few boards to be made at one
time and the pitch of the components is 1.00 and
above.
Needle valve From Dymax Offers
Dispensing Precision
The Model 400 pneumatic, normally closed-needle
valve is designed to deliver precise dots or very fine
beads of low- to medium-viscosity fluids. accurate,
repeatable dispensing can be achieved by utilizing
the valve's material flow adjustment to control shot
volume. The lightweight, wand-style valve body is
compact and lightweight, making it easy and com-
fortable to handle.
manncorp reconfigures, Expands
SmT Solutions
The company has recently reconfigured and ex-
panded its exclusive selection of SMT turnkey
packages, including stencil printing, pick-and-
place, and reflow soldering equipment, to accom-
modate a wider range of production levels and
budgets.
New aLPha LED materials
Introduced in February
The company will introduce its new line of alPha
leD specialty materials technologies at Strategies
in light exposition & Conference, February 25-
27, 2014. These new product technologies reach
across levels one through five of the leD lighting
system manufacturing process: die attach & pack-
age, package on board, luminaire module, power
driver/supply, and control systems.
Indium Names Tim Jensen Senior
Product manager
Indium corporation announces that Tim Jensen
has been named senior product manager for engi-
neered Solders.
BEST to hold advanced X-ray
Inspection Seminar
Presentation topics on april 3 will include:
"advanced Package X-ray Inspection," "bga
and x-ray rework inspection," and "Small Spot
Size x-ray inspection of pops, bgas and lead-
less Devices." The sessions will feature hands-on
"how to" sessions as well as advanced theoreti-
cal sessions.
ZESTrON Presents core Webinar:
"Why clean PcBs"
ZeSTron, the global leading provider of high-
precision cleaning products, services, and
training solutions, is pleased to announce the
first installment of ZeSTron academy's 10-
part 2014 Cleaning webinar Series titled "why
clean Pcbs."
104 SMT Magazine • March 2014
