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104 SMT Magazine • March 2014 SmTonline Supplier/New Product News highlights i3 Electronics: $7m contract for hyperBGa assemblies i3 electronics Inc. announced that an industry lead- ing computing & hardware firm has awarded the company a $7 million contract for the supply of i3's hyperbga assemblies. The contract will run through Q4 of 2014. Tera-Barrier Films Invents alternative Stretchable Plastic Tera-barrier films invents alternative stretchable plastic for prolonging shelf-life of pharmaceuticals, food, and electronics. Indium Intros New Solder Paste Technology The company announced biagX, a high-melting, lead-free solder paste technology designed for high-reliability electronics assembly applications. Designed as a drop-in replacement for standard high lead-containing solder pastes, it has passed MSl1 and thermal cycle testing at several power semiconductor customers. BEST Introduces New Plastic Film Stencils The company has developed a line of Kapton SMT stencils for the prototype assembly market. These stencils, available in 4-, 5-, and 6-mil thicknesses, present very flat coplanar printing surfaces for sol- der paste printing and are designed to be used when there are very few boards to be made at one time and the pitch of the components is 1.00 and above. Needle valve From Dymax Offers Dispensing Precision The Model 400 pneumatic, normally closed-needle valve is designed to deliver precise dots or very fine beads of low- to medium-viscosity fluids. accurate, repeatable dispensing can be achieved by utilizing the valve's material flow adjustment to control shot volume. The lightweight, wand-style valve body is compact and lightweight, making it easy and com- fortable to handle. manncorp reconfigures, Expands SmT Solutions The company has recently reconfigured and ex- panded its exclusive selection of SMT turnkey packages, including stencil printing, pick-and- place, and reflow soldering equipment, to accom- modate a wider range of production levels and budgets. New aLPha LED materials Introduced in February The company will introduce its new line of alPha leD specialty materials technologies at Strategies in light exposition & Conference, February 25- 27, 2014. These new product technologies reach across levels one through five of the leD lighting system manufacturing process: die attach & pack- age, package on board, luminaire module, power driver/supply, and control systems. Indium Names Tim Jensen Senior Product manager Indium corporation announces that Tim Jensen has been named senior product manager for engi- neered Solders. BEST to hold advanced X-ray Inspection Seminar Presentation topics on april 3 will include: "advanced Package X-ray Inspection," "bga and x-ray rework inspection," and "Small Spot Size x-ray inspection of pops, bgas and lead- less Devices." The sessions will feature hands-on "how to" sessions as well as advanced theoreti- cal sessions. ZESTrON Presents core Webinar: "Why clean PcBs" ZeSTron, the global leading provider of high- precision cleaning products, services, and training solutions, is pleased to announce the first installment of ZeSTron academy's 10- part 2014 Cleaning webinar Series titled "why clean Pcbs." 104 SMT Magazine • March 2014

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