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24 SMT Magazine • March 2014 FEaSIBILITY OF LOW/NO SILvEr aLLOY SOLDEr PaSTE maTErIaLS continues results and Discussions Printability Alternative low/no silver alloy solder pastes can print as well as SAC305 solder paste at t=0 (Figure 7). However, some low/no silver alloy solder paste materials (such as A, D, E, F, K) didn't perform well after four hours waiting time as compared to SAC305 solder paste. It is believed that the flux chemistry in the solder paste played an important role in the material printing performance. Wettability In term of wettability, many low/no silver alloy solder performed well in this category. Figure 8 shows the images of Wetting Test 1 for a SAC305, SAC0307 and SN100C alloy solder paste. These three solder pastes averagely had a similar spreading diameter. Table 2: reflow profiles summary. figure 7: Printability of low/no silver alloy solder pastes at t=0. feaTure