SMT007 Magazine

SMT-Mar2014

Issue link: https://iconnect007.uberflip.com/i/270052

Contents of this Issue

Navigation

Page 80 of 112

March 2014 • SMT Magazine 81 rELIaBILITY aSSESSmENT OF NO-cLEaN aND WaTEr-SOLUBLE SOLDEr PaSTES, ParT 1 contin ues feaTure Table 3: Paste a and c slump test. Figure 5a: Slump for 0.63x2.03 pad size. Figure 5b: Slump for 0.33x2.03 pad size.

Articles in this issue

Archives of this issue

view archives of SMT007 Magazine - SMT-Mar2014