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20 SMT Magazine • March 2014 low/no silver alloy solder pastes. In this article, we will discuss the process feasibility and chal- lenges of low/no silver alloy solder pastes. alternative Low/No Silver alloy Solder Pastes In the study, we evaluated 11 different alter- natives alloys and compared their performance with the control SAC305 solder paste (Table 1). Type 3 was used in the evaluation. Sn3.0Ag0.5Cu alloy typically melts at ~217°C. Alternative low/ no alloys have about 10°C higher melting tem- perature than SAC305 solder paste. Its liquidus temperature ranges from 225°C to 228°C. Test vehicle Flextronics multi-function test vehicle is used in the evaluations (Figure 1). The board dimensions are 225 mm x 150 mm x 1.67 mm. The board surface finish is OSP. The test vehicle FEaSIBILITY OF LOW/NO SILvEr aLLOY SOLDEr PaSTE maTErIaLS continues feaTure figure 1: five-year silver history chart. Table 1: alternative low/no silver alloy solder pastes.