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64 SMT Magazine • March 2014 substrates and analyzed by cross-sections. Fig- ure 5 shows intermetallic with a quantity of 3.75% Ag, which means the silver content was fixed at 2.5%. A further investigation was done by a DSC analysis to finalize the melting point/rang of those alloys. As result of that DSC, the alloy with 2.5% Ag has a melting range from 210°C to 217°C and was selected for the final alloy. Technology Qualification for hT1 Different solder pastes/alloys on real DCBs were qualified for the technology. The steps for the qualification were: • Printing and measurement of the solder deposits after printing • X-ray • Cleaning with two mediums and cleaner • TCT 30'/10''/30 with -40/+125 and -40/175°C The first interpretation of the results fo- cuses on cross-section results after N=500 by -40/+175, Figures 6a to 6c. feaTure aSSEmBLY maTErIaLS FOr hIGh-TEmPEraTUrE aPPLIcaTIONS continues Figure 4: (a) SaC + in (without modifier); and, (b) SaC+in+KM (source: Müller, nMb 160804). Figure 5: Cross-section with 3.75% ag, ag3Sn. Figures 6: (a) Snag.5; (b) hT1; and (c) innolot.