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March 2014 • SMT Magazine 81 rELIaBILITY aSSESSmENT OF NO-cLEaN aND WaTEr-SOLUBLE SOLDEr PaSTES, ParT 1 contin ues feaTure Table 3: Paste a and c slump test. Figure 5a: Slump for 0.63x2.03 pad size. Figure 5b: Slump for 0.33x2.03 pad size.