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46 The PCB Magazine • March 2014 ated the degree of failures for each material. It is also important to see that materials 'E', 'RA' and 'RB' had 100% failures. These results are in line with IST and capacitance results. Those materials which had poor performance for IST and capacitance also showed poor re- sults for CAF. Signal Integrity (overall insertion loss) Test Conditions: • Conductor length: 5 inches • Impedance: 50 ohms • Materials: RA, RB, A, B, C, D and E • Equipment used: Agilent VNA N5230 • Testing done at ITEQ labs Test Results Insertion Losses for Microstrip Line Figure 14 shows a clear separation is seen be- tween materials as the frequency increases from 10GHz to 20GHz. Material 'RB' still has the lowest Df value at -1.894dB/inch at 20GHz. Per- centage change for material 'RB' was the lowest at 66%. Material 'C' had the highest percentage change at 79%. The same was true for the stripline. Material 'RB' had the lowest Df value at -1.939dB/inch and material 'C' had the highest Dk loss at -3.376dB/ inch. Materials 'A' and 'RB' had the lowest per- centage change at 87%. Materials 'E' and 'RA' had the highest percentage change at 94%. BEHAVIOR OF MATERIALS IN THE MANUFACTURING ENVIRONMENT continues Figure 14. Figure 15.