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56 SMT Magazine • April 2014 All of the samples tested passed IPC SIR test- ing without issue. An example of the data gen- erated found below: pass-Fail Criteria ipC J-STD-004B §3.4.1.4.1 • All measurements on all test patterns shall be exceed the 100 MΩ • No evidence electrochemical migration that reduces conductor spacing by more than 20%. No corrosion of the conductors Test results 1. Test data, chart attached, pass 2. Presence of dendrites: No 3. Maximum percent reduction of spacing: 0%. 4. Presence of discoloration between conductors: No 5. Presence of water spots: No 6. Presence of subsurface metal migration: No Original test data available upon request. Results are shown in Charts 6–8: In this study, we will address the find- ings of an in-depth analysis of various types of conformal coatings and how they perform in combination with a variety of no-clean flux residues. The following industry test standards were applied: • IPC J-Std-004 SIR testing • IPC CC-830 - Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies • ASTM – D3359 - Standard Test Methods for Measuring Adhesion by Tape Test The three standards applied to this study will determine the SIR values and adhesion prop- erties of each material in combination. These figures were compared with supplier-provided data on the individual materials to determine if characteristics were measurably enhanced or degraded when combined. The classes of con- formal coating materials tested are outlined in Charts 1-5. fEATurE CONFOrMal COaTiNG OvEr NO-ClEaN FlUX continues chart 6: "l" uV cure coated, "Paste 54" (Sn-Pb), "control".