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28 SMT Magazine • April 2014 where as the tin layer is made either by solder dip process or barrel plating. The outer layer of tin has very rough surface morphology due to the barrel plating process. For more details on the manufacturing of mul- tilayer ceramic chip capacitors the reader is re- ferred to Kahn, et al. [12] . SMT This article will be continued in the May issue of SMT Magazine. references 1. S. Matsumoto, "The measurement of tiny dew droplets at the initial deposition stage and dew point using a phase-shift interference mi- croscope." Meas. Sci. Technol. Vol. 14, pp. 2075- 2080, 2003. 2. D. Minzari, PhD Thesis, Technical Univer- sity of Denmark, 2010. 3. M. Yunovich, Appendix Z – Electronics, pp. Z1-Z7, www.corrosioncost.com/pdf/electronics.pdf. 4. H. Risto et al., "Corrosion and climatic ef- fects in electronics", Published by VTT Automa- tion, Finland, 2000. 5. G. Di Giacomo, "Reliability of electronic packages and semiconductor devices", McGraw- Hill, USA, 1996. 6. D. Minzari, M.S. Jellesen, R. Ambat, "Mor- phological study of corrosion of silver in sulphur environments," Engineering failure analysis, Vol. 18, 2126, 2011. 7. M. Pourbaix, "Atlas of electrochemical equilibrium in aqueous solutions," M. Pourbaix, Published by NACE, 1974. 8. D. Minzari, M.S. Jellesen, P. Møller, R. Am - bat, "On the mechanism of electrochemical mi- gration of tin,"Corrosion Science, Vol. 53, pp. 3336, 2011. 9. P.G. Slade, "Electrical contacts: principles and applications," CRC Press, 1999. 10. R. Holm and E. Holm, "Electric contacts: theory and application," 1967. 11. F.G. Chen and A.J. Osteraas, "Electro - chemical dendrite formation during corrosion of connector leads," Electronic Packaging and Cor- rosion in Microelectronics, pp. 175-184, 1987. 12. M. Kahn et al., "Ceramic Capacitor Tech- nology," Electronic Ceramics, Edited by L.M. Levinson, New York, USA: Marcel Dekker, pp. 191–275, 1988. 13. R.P. Prasad, "Surface mount technology: principles and practice," Springer, 1997. 14. Z.H. Levine and B. Ravel, "Identification of materials in integrated circuit interconnects using x-ray absorption near-edge spectroscopy," Journal of Applied Physics, vol. 85, pp. 558, 1999. 558. 15. G.K. Rao, Multilevel interconnect tech - nology, McGraw-Hill, 1993. 16. R. Ambat and Møller, P., "Corrosion and environmental effects on electronics," Proceed- ings of Korrosion-Mekanismer, Havarier, Beskyt- telse, 2005. 17. T. Matsumoto, M. Noguchi, and K. Aso, Lead frame material, Google Patents, 2000. 18. O.V. Elisseeva, A. Bruhn, A. Heyer, A. Ma- vinkurve, R.T.H. Rongen, G.M. O'Halloran, R. Ambat, J.M.C. Mol, H. Terryn, J.H.W. de Wit, "Al-Au covered silicon chips studied by the local electrochemical techniques," Proc. of Eurocorr 2011, Stockholm, Sweden, 4-8 September 2011. 19. R.B. Comizzoli, R.P. Frankenthal, P.C. Mil- ner, and J.D. Sinclair, "Corrosion of Electronic Materials and Devices," Science, vol. 234, pp. 340-345, 1986. 20. C.J. Tautscher, Contamination effects on electronic products: a basic discussion of com- mon contaminants, their origin, effects, remov- al, and control, and product protection against contaminants from the use environment, CRC, 1991. 21. J.A. Jachim, G.B. Freeman, and L.J. Turbi- ni, "Use of surface insulation resistance and con- tact angle measurements to characterize the in- teractions of three water soluble fluxes with FR-4 substrates," Components, Packaging, and Manu- facturing Technology, Part B: Advanced Pack- aging, IEEE Transactions, Vol. 20, pp. 443–451, 1997. 22. Information on www.residues.com, 2012. 23. T. Munson, "The downside of selective sol- dering, Articles from www.residues.com, 2012. fEATurE CliMaTiC rEliaBiliTY OF ElECTrONiC DEviCES aND COMpONENTS continues rajan Ambat is a professor of Materials and Surface engineering, Department of Mechanical Engineering, Technical university of Denmark. To contact him, click here.