PCB007 Magazine

52 The PCB Magazine • April 2014

• Cover
• Featured Content — HDI
• Contents
• Column — Sustainability—What and Why?
• Untitled
• Short — Smarter Smartphone with "Deep Learning" Innovation
• Feature — Lead-Free Reflow for High-Layer-Count PCBs
• Feature — HDI PWB Reliability
• Short — Unavoidable Disorder Used to Build Nanolaser
• Feature — From Single-Sided to HDI: The "Three Phone Call Method" Works!
• Feature Video Interview — New Dimension in Pinless Multilayer Registration
• Show Review — IPC APEX EXPO 2014: The Opening Keynote Session
• Show Review — IPC APEX EXPO 2014: Publisher's Report
• Show Review — IPC APEX EXPO 2014: Editor's Notes
• Show Review — Designers Step up at Design Forum
• Show Review — IPC APEX EXPO 2014: Photo Collages
• Column — Is Your DAM Job Killing You?
• News — Mil/Aero007 News Highlights
• Column — Green Technologies in PCB Fabrication
• Video Interview — The Impact of Miniaturization on Fab Processes
• Column — Customer Feedback: Perception is Reality
• News — PCB007 Supplier/New Product News Highlights
• Column — PTH Drilling Revisited: Fundamentals, Part 1
• Column — A Summary of Various Test Requirements
• Video Interview — Printed Circuit Handbook, 7th Ed., Coming Soon
• News — PCB007 Market News Highlights
• Column — The Conundrum of RF/Microwave and High-Performance PCBs
• News — Top Ten PCB007 News Highlights this Month
• Events Calendar
• Advertiser Index and Masthead