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PCB-June2014

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32 The PCB Magazine • June 2014 The stretchable circuit board includes sev- en double disks areas distributed across the stretchable elastomer matrix to host each of the seven discrete components (four resistors, one capacitance, and one op-amp). Stretchable thin gold film interconnects are patterned on the top surface of the elastomer membrane to complete the circuit. The components are po- sitioned above the rigid areas and electrically connected with the stretchable wiring using silver paste. When the circuit is stretched, the resistance of the meander is increased, decreasing the flashing rate of the LED. Graph 4c shows the flashing rate of the LED, which linearly decreas- es with the applied tensile strain. The stretch- able resistance increases by about a factor of four when stretched to 20% strain leading to a frequency decrease from 1.55 to 1.15, corre- sponding to the theoretical variation of f. Conclusion This paper provides a solution to a very common problem faced in fabricating stretch- able circuits. When non-stretchable regions are created in a stretchable media, for example, PDMS, high-strain regions are created while stretching. For practical circuits, electrical wir- ing between components must run across the stretchable and non-stretchable regions, where large tensile strain may occur and lead to poor reliability of the electrical circuit and early elec- tromechanical failure. The "double disk" design proposed in this paper provides a simple, yet efficient strategy to integrate disparate electri- cal components on a stretchable substrate. The proposed stretchable circuit boards will allow for straightforward manufacturing of stretch- able electronics. Acknowledgements This work was supported by the UK Engi- neering and Physical Sciences Research Coun- cil—EPSRC, the Bertarelli Foundation, and a Eu- ropean Research Council Starting Grant, ERC, No. 259419. Q.Liu and Z.Suo acknowledge the support of the National Science Foundation Materials Research Science and Engineering Center. PCB References 1. T. Someya, Stretchable Electronics (Wiley, 2013). 2. T. Someya, Y. Kato, T. Sekitani, S. Iba, Y. No- guchi, Y. Murase, H. Kawaguchi, and T. Sakurai, Proc. Natl. Acad. Sci. U.S.A. 102(35), 12321–12325 (2005). 3. B. C.-K. Tee, C. Wang, R. Allen, and Z. Bao, Nature Nanotechnology 7, 825–832 (2012). 4. S. P. Lacour, I. M. Graz, S. Bauer, and S. Wag- ner, IEEE Engineering in Medicine and Biology Conference (IEEE, Boston, 2011), pp. 8373–8376. 5. M. L. Hammock, A. Chortos, B.C.-K. Lee, J. B.-H. Tok, and Z. Bao, Adv. Mater. 25, 5997–6038 (2013). 6. M. Kaltenbrunner, T. Sekitani, J. Reeder, T. Yokota, K. Kuribara, T. Tokuhara, M. Drack, R. Schw€odiauer, I. Graz, S. Bauer-Gogonea, S. Bauer, and T. Someya, Nature 499, 458–463 (2013). 7. D.-H. Kim, N. Lu, R. Ma, Y.-S. Kim, R.-H. Kim, S. Wang, J. Wu, S. M. Won, H. Tao, A. Is- lam, K. J. Yu, T.-I. Kim, R. Chowdhury, M. Ying, L. Xu, M. Li, H.-J. Chung, H. Keum, M. McCormick, P. Liu, Y.-W. Zhang, F. G. Omenetto, Y. Huang, T. Coleman, and J. A. Rogers, Science 333, 838–843 (2011). 8. J.-W. Jeong, W.-H. Yeo, A. Akhtar, J.J.S. Nor- ton, Y.-J. Kwack, S. Li, S.- Y. Jung, Y. Su, W. Lee, J. Xia, H. Cheng, Y. Huang, W.-S. Choi, T. Bretl, and J. A. Rogers, Adv. Mater. 25, 6839–6846 (2013). 9. D.-H. Kim, N. Lu, Y. Huang, and J. A. Rog- ers, MRS Bulletin 37, 226–235 (2012). 10. J. Vanfleteren, M. Gonzalez, F. Bossuyt, Y.- Y. Hsu, T. Vervust, I. D. Wolf, and M. Jablonski, MRS Bulletin 37, 254–260 (2012). 11. F. Bossuyt, T. Vervust, and J. Vanfleteren, IEEE Transactions on Components, Packaging and Manufacturing Technology, 3(2), 229–235 (2013). 12. A. Romeo, Q. Liu, Z. Suo, and S. P. Lacour, Appl. Phys. Lett. 102(13), 131904 (2013). 13. I. Graz, D. Cotton, and S. P. Lacour, Appl. Phys. Lett. 94, 071902 (2009). 14. D. P. J. Cotton, A. Popel, I. M. Graz, and S. P. Lacour, J. Appl. Phys. 109, 054905 (2011). 15. I. Graz, D. Cotton, A. Robinson, and S. P. Lacour, Appl. Phys. Lett. 98, 124101 (2011). 16. All figures courtesy of Journal of Applied Physics. HyBRID STRETCHABLE CIRCUITS oN SILICoNE SUBSTRATE continues

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