PCB007 Magazine
PCB-July2014
Issue link:
https://iconnect007.uberflip.com/i/340751
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Contents
Column — Electronic Assembly with Solder: an Unblinking Look at "The Devil We Know"
Panel Discussion Video — The Great File Format Transfer Debate
Feature — Device Embedding in PCBs: Evolution or Revolution?
Feature — RF Capacitor Material for Use in PCBs
Feature — Embedded Resistors in Low Ohmic Applications
Feature — Electrical Testing of Passive Components
Reader Response — Gerber—the Smartest Way Forward
Reader Response — Julian Coates' Rebuttal
Video Interview — IPC-7092: Embedded Standard Update
News — PCB007 Market News Highlights
Column — IMPACT 2014: IPC on Capitol Hill "Leadership in Promoting a Strong Manufacturing Economy"
News — PCB007 Supplier/New Product News Highlights
Article — Isolation Testing and Adjacency
Column — Why Removing Your Bottleneck is a Bad Idea
Video Interview — ETI/NEA: Combining Expertise through Merger
News — Mil/Aero007 News Highlights
Column — Oxide Alternative Processes: Performance Characteristics
Short — New Hybrid Circuit Could Take the Place of Silicon
News — Top Ten PCB007 News Highlights this Month
Events Calendar
Advertiser Index and Masthead
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