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Surface Treatment Technology CupraEtch DE – Differential Etch for SAP/MSAP Electronics Sulfuric Acid / Peroxide CupraEtch DE The Process ▪ Ferric sulfate etch based with organic additives for etch stabilization ▪ Stable single step low-temperature process ▪ Removal of copper seed layer within SAP or MSAP technology ▪ Operation in combination with recovery unit Technical Benefits ▪ Clean, controlled and reliable removal of copper seed layer CpK ≥ 1.3 or 4σ ▪ Controlled etch rate ± 10%; stable etch factor Economical Benefits ▪ Solution regeneration and copper recovery ≥ 90% Environmental Benefit ▪ Reduction of waste water ≥ 90% CupraEtch DE Process CupraEtch DE 30 – 40 °C / 30 – 60 s After CupraEtch DE Clean seed layer remo- val with no undercut Before CupraEtch DE Ad14_STT_CupraEtchDE_PCB_203x267.indd 1 19.06.2014 08:24:02

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