Issue link: https://iconnect007.uberflip.com/i/340751
24 The PCB Magazine • July 2014 DEvICE EMBEDDING IN PCBS: EvOLUTION OR REvOLUTION? continues Figure 7: device embedded technology in PcBs using standard packaged components. active multilayer (aMl ® ) technology developed by hofmann leiterplatten in germany can use standard components including connectors inside the PcB. Miniaturisation, reliability and improved thermal management are achieved simultaneously [2] . Figure 8: Mosfet components on standard assembled PcBs can generate high temperature, as cooling is only by ambient air which has low thermal conductivity [2] .