Indium10.1 Solder Paste
• Superior QFN and BGA
voiding resistance
• Eliminates head-in-pillow
defects
• Provides excellent graping
resistance
• Long-lasting oxygen barrier
during reflow
• Consistent high print
transfer efficiency
Learn more:
http://indium.us/D1148
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Industry Leading Paste
Indium10.1
>50% Less Voiding!
