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36 The PCB Magazine • September 2014 ature thermoplastic. These include numerous types of materials that are suitable for lead-free soldering. Here are a few examples of materials: • Pocan ® is a thermoplastic polyester based on polybutylene terephthalate (PBT) and poly- ethylene terephthalate (PET) developed by Lanxess. Pocan possesses a high resistance to heat distortion, and good strength and hardness characteristics. In addition it has high abrasion resistance, good chemical resistance, good elec- trical insulating and dielectric properties, high creepage current resistance and low moisture absorption. There are several variants of Pocan available to meet different temperature require- ments. The material can be easily soldered and laser welding also produces the best results. • PA6/6T is a partially aromatic polyamide based on Ultramid ® from BASF AG. The mate- rial is distinguished by a high resistance to heat distortion and good mechanical properties. The short-time heat resistance can be increased up to 400°C (750°F) by using a crosslinkable vari- ant of this material. • A crosslinkable PBT (polybutylene tere- phthalate) based on Vestodur ® from Degussa AG, with the good qualities of a standard PBT, also guarantees a high degree of distortion re- sistance. • LCP (liquid crystal polymer) based on Vec- tra ® from Ticona GmbH has a low melt viscosity and very high heat distortion resistance. • PC/ABS (polycarbonate/acrylonitrile/bu- tadiene/styrene) from DSM also has very good surface and mechanical properties. Past LDS plastics were black because of the inherent color of black LDS additives. Now this restriction has also been lifted, as the innovative 3D LDS COMPONENTS continues figure 7: plastic pyramid: almost all manufacturers offer their thermoplastics with lds additive ex factory.