Electrochemical corrosion, dendritic growth,
conductive anodic filaments, BGA cracking
and lead-free solder joint thermo-
mechanical fatigue can all have
negative impacts on the reliability
and performance of today's high
technology electronics.
IPC Europe High Reliability
Forum, a two-day conference co-
developed by top organizations
including: Airbus, Celestica, COM
DEV, Continental Automotive, The
European Space Agency, Gen3 Systems,
The National Physical Laboratory, Robert
Bosch, Thales and Zestron will bring
together leading experts from industry
and research institutions to explore these
critical reliability issues and more facing
European electronics designers
and manufacturers.
IPC Europe High Reliability Forum
14–15 October, 2014 | Düsseldorf, Germany
www.ipc.org/eu-high-reliability
REGISTER NOW
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