Atotech copper plating process Cupracid AC
for conformal applications has been qualified
for use in a wide range of vertical conveyorized
systems as well as for hoist type equipments.
Process
▪ Conformal copper plating with soluble
anodes under DC plating conditions
▪ Technology is well suited for high current
densities for high productivity
▪ Capable for use in panel or pattern plating
mode
▪ Capable with either force flood sparger or air
agitation
▪ Can be used in VCL or hoist type equipment
Features and Benefit
▪ Excellent throwing power at high current
density in BMV and also through holes
▪ Uniform copper distribution over the board
surface
▪ Low stressed, ductile and bright plated
copper deposit
▪ All process additives may be controlled with
standard analysis procedure based on CVS
for simple maintenance
Cupracid AC at 3 A/dm²
BMV diameter 150 μm
Depth 80 μm
Panel / Pattern Plating
Cupracid AC – High Speed Conformal Plating
for Vertical Conveyorized Systems
Electronics
Atotech Main Office · .O. Box 21 07 80 · 10507 Berlin · Germany
Tel.: +49 30 - 349 85-0 · Fax:+49 30 - 349 85-777 · www.atotech.com
Cupracid AC at 3 A/dm²
Panel 1.2 mm thick
Hole diameter 0.25 mm
Throwing power
>90 % min
