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Commitment to the Future Sustainability Driven by Innovation Electronics Atotech Headquarters P.O. Box 21 07 80 · 10507 Berlin · Germany · www.atotech.com Tel. +49 30-349 85-0 · Fax +49 30-349 85-777 Plating Through Hole Final Finishing Panel / Pattern Plating Semiconductor Technology Environmentally friendly processes enable customers to be more profitable in a sustainable way while reducing their environmental footprint. Surface Treatment Technology Bonding Enhancement with Reduction in Copper Waste and Chemistry Consumption Recyclable Etching enabling Solution Regeneration and Copper Recovery Thiourea Replacement EDTA-free Electroless Copper Formaldehyde-free Electroless Copper Cyanide and Nickel-free Electroless Copper Biodegradable Cleaners Nickel and Boric-free Chemistry Reduction in Chemical Consumption and up to 50% less Copper on Surface Cyanide-free Immersion Gold Replacement of Nickel in Surface Finishes for Soldering and Bonding Lead-free, Bismuth-free and Antimony-free Nickel- Phosphor Deposition Lead-free Surface Finishes (Tin and NiAu) Cyanide-free Electroless Gold Lead-free Nickel Pad for Wire Bonding and Solder Bumping Cyanide-free Zincates for Aluminum Pads