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24 The PCB Magazine • October 2014 WEARABLE ELECTRONICS continues over 3GHz. This feature coupled with the well- known advantages of embedded SiP improves transceiver gain and efficiency as shown in Table 1. These results can be further extended with modifications to the engineered materials. A 5 mm x 5 mm printed PCB antenna gave results shown in Figure 6. Without any ground plane extensions that would increase the overall foot- print of the device, well-defined resonance was achieved at about 1.9GHz. This opens the door to either AiP (antenna-in-package) or antenna miniaturization in a product no larger than a U.S. quarter. The TransSiP 3D embedded structure is shown in Figure 7. The process uses B2it tech- nology to enable co-lamination of subassem- blies during the embedding step, while build- up layers can be done using either B2it or the ALIVH-type variants, or lase-and-plate sequen- tial processes. Either way, the benefits of embedding com- bined with any-layer buildup technologies are seen in: • improved routing flexibility for high speed lines with specific voltage referencing and shielding requirements • reduced crosstalk between vias due to flexible via placement and shorter barrel length • reduced parasitics due to lower via inductance • improved impedance matching around via table 1: Comparative results: gPs patch antenna. figure 6: radiation field and resonance for a 5 x 5 mm aiP. (source: transsiP)