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62 SMT Magazine • November 2014 part of the solder paste which only comprises of approximately 12% of the formulation (w/w) determines the printing characteristics, reflow performance and the critical electrochemical reliability of the final assembly. The successful formulation strategy of a solder paste relies on the material being 'active' towards a range of metal oxides typically found on PCBs and elec- HigH-reLiabiLity, Pb-Free, HaLogen-Free soLDer continues arTiCle figure 5: Creep resistance as a function of temperature. Figure 6a and b: Comparative failure rates for Snpb, SaC and high-reliability six-part alloy in 1206 (a) and 2512 (b) type components assembled on oSp pCbs.