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48 The PCB Magazine • December 2014 n e W S Orbotech Unveils Next-generation DI Solution orbotech ltd. announced that it will be launching its newest direct imaging (di) system, the cutting- edge nuvogo 800, for digital imaging of fine-line hdi, mlb, flex, and rigid-flex applications for mass production, at the tPca Show. DuPont Debuts Pure Copper Conductive Ink duPont microcircuit materials (duPont) is intro- ducing its first pure copper conductive ink for pho- tonic curing, duPont™ Pe510 copper conductor. duPont™ Pe510 is a cost-effective alternative to silver conductor inks for a variety of possible appli- cations and is the newest product in a suite of con- ductive ink materials specifically tailored for use in certain types of antenna, membrane touch switch (mtS), radio-frequency identification (rFid), and consumer electronic applications. ESI Unveils New Laser Micromachining Platform electro Scientific industries, inc. has announced the µFlex Series multi-axis precision laser micro- machining platform, enabling new levels of price- performance in laser applications for consumer electronics, medical devices, automotive compo- nents, and many other industries. MacDermid Electronics Solutions Launches M-Speed the company has announced the release of m- Speed, a complete chemical process supporting fabrication of high-frequency Pcbs. this uniquely- formulated process provides low-profile innerlayer copper while delivering reliably strong adhesion to all high-speed dielectrics. Technica USA Installs Second Maskless DI Machine at APCT "We are very pleased with the continued sales ac- tivity and interest in the maskless di equipment. We have installed four units in the past quarter and have had several successful evaluations during this same period," said Frank medina, president. LPkF: Renewed Growth Expected in 2015 after having experienced average annual growth of 23% over the past five years, in october 2014 the tecdax company had to adjust its annual profit forecast downward for the first time in six years and prepare its investors for lower revenue and earnings in 2014. Molex Develops 3D Moulded Technology this innovative 3d technology combines advanced mid technology with ldS antenna expertise to de- liver integrated fine-pitch 3d circuitry in a single molded package suitable for high-density medical devices meeting stringent medical grade guidelines. Orbotech Defies Market Weakness; Posts Solid Q3 Growth commenting on the results, asher levy, ceo, said, "the overall business environment was solid dur- ing the quarter, notwithstanding some weakness in the Pcb industry. For orbotech, the quarter was marked by a strong momentum of innovation." revenues for the first nine months of 2014 totaled $385.3 million, compared to $317.8 million re- corded in the first nine months of 2013. Rogers Printed Circuit Materials Sets Q3 Sales Record bruce d. hoechner, president and ceo, comment- ed, "We are very pleased to report that in the third quarter, we set another all-time quarterly revenue record and posted our seventh consecutive quar- ter of year-over-year revenue growth. all three of our business segments contributed solid results and, overall, we saw strong gains in both gross margin and operating margin resulting in excel- lent earnings." Isola Completes Testing of Laminate Materials the company has announced the successful com- pletion of class 2 testing of laminate materials for conductive anodic Filament (caF) resistance. the laminate materials were constructed with glass fabric woven at isola Fabrics, a subsidiary of isola group S.à r.l. PCB007 Supplier/New Product News Highlights 48 The PCB Magazine • December 2014

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