Issue link: https://iconnect007.uberflip.com/i/431081
24 The PCB Design Magazine • December 2014 • The via models are simple and it won't be difficult to find vendors who can fabricate it. • The GND plane on the outer layers provides a high rating for power and signal integrity. Stackup B comments: • The GND and VCC on the outer layers provide the best power and signal integrity. • The additional buildup layer increases the cost (more laminations, drills and plating steps) but also improves the route density as opposed to losing an HDI routing layer due to the VCC plane. • The via models are simple and it won't be difficult to find vendors who can fabricate it. Stackup C comments: • The stacked vias enable the best route density but also increases the cost and may limit the number of vendors who can fabricate this stackup. • The GND plane on the outer layers provides the high rating for power and signal integrity. Secondary HDI Stackups These stackups are useful in their own way, depending on your priorities, but they are not as good overall as the Top 3. Stackup D comments: • The GND plane on the outer layers provides a high rating for power and signal integrity. HDI LAYER STACkUPS FOR LARGE, DENSE PCBS continues feature Figure 10: stackup B, another good HDI stackup. Figure 11: stackup C, also a good HDI stackup. Figure 12: stackup D, a secondary HDI stackup.