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March 2015 • The PCB Magazine 43 RELIABILITy TESTING AND STATISTICS continues Feature 12. NIST Engineering Statistics Handbook. (2012). 13. Neumann, S., Dambrowsky, N., & Kenny, S. (2009). Theoretical and Practical Aspects of Thermal Mechanical Reliability in Printed Cir- cuit Boards with Copper Plated Through Holes. (Website) Retrieved 11 Sept, 2014. 14. Fox, A. (1976). "Mechanical Properties at Elevated Temperature of CuBath® Electroplated Copper for Multilayer Boards," Journal of Test- ing and Evaluation, JTEVA, Vol., No. 1, Jan., pp. 74–84. 15. Lau, J. (1993). Thermal Stress and Strain in Microelectronics Packaging. Springer US, New York, NY. 16. Reliable Plated Through-Via Design and Fabrication. DfR Webinar June, 2012. 17. Nelson, W. (1990). Accelerated Testing: Statistical Models, Test Plans, and Data Analy- ses. John Wiley & Sons, New York, NY. 18. IPC-TR-579 Round Robin Reliability Eval- uation of Small Diameter Plated-Through Holes in Printed Wiring Boards. September 1988. 19. SSB-1: Guidelines for Using Plastic En- capsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applica- tions. November 2000. 20. Kindale, K. (2009, November). "Failure Mechanisms in Lead-Free Laminates." Printed Circuit Design & Fab, pgs 24–29. 21. Sherlock Automated Design Analysis TM . 22. IPC-TM-650 2.6.26 Rev. A. DC Current Induced Thermal Cycling Test. 23. Box, G. & Draper, N. (1987) Empirical Model-Building and Response Surfaces. John Wiley & Sons, New York, NY. patrick Valentine is the global director of technology & Lean Six Sigma for OM Group Electronic Chemicals and has been with the company since 1991. To contact the author, click here. realtimewith.com CliCk To View Video interView The 2015 event had higher at- tendance and in general many exhibitors seem happy with the quantity and quality of those at- tending. Sanjay also discusses the increased membership as well as the IpC global efforts. Of particular interest is his vision for the newly formed ambassadors Council and its new mentoring efforts. The locations for the next four apEx ExpO shows were also confirmed. Sanjay Hupikar and Dan Feinberg Discuss IPC APEX EXPO 2015 by Real Time with... IPC APEX EXPO 2015

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