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PCBD-Mar2015

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March 2015 • The PCB Design Magazine 65 5 Zuken, SiSoft Collaborate on Multi-gigabit Design and Analysis Solutions zuken and sisoftTM have united to deliver solu- tions for complex high-speed designs and multi- gigabit applications. By integrating sisoft's ad- vanced signal integrity solutions for state-of-the- art, high-speed digital system design with zuken's 3D multi-board, system-level platform, the two companies will provide a combined design and verification flow. 6 Mentor Graphics Joins CPES Mentor graphics Corporation has joined the Cen- ter for Power electronics systems (CPes) at vir- ginia Tech, the industry consortium dedicated to improving electrical power processing and distri- bution across various systems. 7 Altium Updates its Flagship PCB Design Tool The next update to Altium's flagship PCB design tool, Altium Designer 15.1, will introduce several new features for improved design productivity, doc- umentation outputs, and high-speed design effi- ciency. Altium Designer 15.1 also enhances the core philosophy of the software, with a continued focus on improved design productivity and efficiency. 8 Zuken Schedules Innovation World 2015 Customer Events zuken has announced the locations and dates for its popular zuken innovation world conferences. The conferences launch in germany in May, mov- ing around europe and north America, before landing in Japan in october. Registration is now open for most events. 9 Mentor Posts Record Q4, Fy15 Results Mentor graphics Corporation today announced financial results for the company's fiscal fourth quarter ended January 31, 2015. The company reported revenues of $439.1 million, non-gAAP earnings per share of $1.09, and gAAP earnings per share of $0.96. For the full fiscal year, revenues were $1.244 billion, non-gAAP earnings per share were $1.77, and gAAP earnings per share were $1.26. J IPC APEX EXPO Selects Best Tech Paper Taking top honors, the winning paper is "High- Frequency loss Test Methods for laminate Ma- terials Comparison (a High-Density Packaging user group/HDPug Project)," by Karl sauter, or- acle Corporation usA. His co-author was Joseph smetana, Alcatel-lucent. The paper was presented at APeX on February 26. PCBDesign007.com for the latest circuit design news—anywhere, anytime. March 2015 • The PCB Design Magazine 65

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