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Conference Overview Join us for the 9 th annual International Conference on Soldering and Reliability. Materials as different as graphene, nanofibers and coatings will be discussed. Common topics like stencils for disparate-sized components, tin whiskers, head on pillow and specific reliability issues will be highlighted. RoHS initial implementation may be well behind us, but the implications are still resounding through our industry. There will be two sessions on lead free solders, with one concentrating on bismuth- containing possibilities. It will be an information- packed two days! International Conference on Soldering and Reliability May 19 – 21, 2015 Hilton Markham Suites Markham, Ontario, Canada Technical Committee: Bev Christian, Ph.D., BlackBerry Martin Anselm, Ph.D., Rochester Institute of Technology (RIT) Peter Arrowsmith, Ph.D., Ops A La Carte Matthew Kelly, P.Eng, MBA, IBM Corporation Polina Snugovsky, Ph.D., Celestica, Inc. Tim Luke, Alpha Keynote Address: Electronic Industry Collaboration – Critical 21st Century Supply Chain Tools Media Partners: Co-located Toronto Expo & Tech Forum Your local electronics assembly and manufacturing trade show! Free technical sessions Free lunch Networking Supporting Partner: Bill Bader CEO, iNEMI Workshops: May 19 Conference: May 20 – 21 Toronto Expo & Tech Forum: May 21

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