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April 2015 • SMT Magazine 17 with these various reflow profiles. Both were Pb-free, containing SAC305 as the alloy. One was halogen-containing and the other was halogen-free. The purpose of the two different chemistries was to see if halogen-containing and halogen-free solder pastes responded dif- ferently to the reflow profiles in terms of their SIR performance. A total of two SIR test cou- pons were prepared and tested for each solder paste/reflow profile scenario (Table 2). Because the SIR chamber had a limited capacity of 20 boards per test, the boards were tested in two groups. The results of the SIR testing are shown in the following section. ElECTriCal rEliaBiliTy OF NO-ClEaN SOlDEr paSTE Flux rESiDuES continues FeAture Table 2: Solder paste/reflow profile matrix.