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4 The PCB Magazine • April 2015 8 Next-Generation Ultra-Thin HDI PCB Manufacturing Challenges by Tarja Rapala-Virtanen, Erkko Helminen and Timo Jokela High-Density Interconnects: Enabling the Intelligence of Things by William Beckenbaugh, Ph.D. and Joan K. Vrtis, Ph.D. Splitting Hairs: The Manufacture of HDI and Substrate Test Fixtures by Todd Kolmodin April Featured Content 20 32 This month, high density interconnect gets the scrutiny of industrial professionals from TTM Technolo- gies, Multek, and Gardien Services, who discuss the challenges of ultra-thin HDI PCB manufacturing, and how HDI relates to the Internet of Things (IoT) and substrate test fixtures. HDI

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