The Process
▪ Conveyorized metallization and plating system
▪ Proven in high volume HDI production
▪ Inpulse 2HF with insoluble anodes gives longest
electrolyte lifetime in full production
▪ Superlative filling results with minimum surface plated copper
▪ Filled BMV with less than 5 µm dimple
Savings
▪ 50% less plated copper on surface
▪ Reduced soldermask consumption
▪ Reduced etching process consumption
▪ Minimum processing time for filling
▪ Less wastewater treatment
Features and Benefits
▪ High productivity
▪ Excellent surface uniformity
▪ 2 MIL line and space capability
▪ Lowest possible surface Cu plated for BMV filling
Filled stacked BMV for mobile
phone production with Inpulse 2HF
and SuperFilling
Diameter 170 μm / Depth 100 μm
Plating thickness 15 μm
Plating time approx. 30 min
Dimple < 10 μm
Atotech | www.atotech.com | Email: info@atotech.com
Atotech's Inpulse 2HF –
The Low Cost Solution
for Blind Micro Via Filling
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