Issue link: https://iconnect007.uberflip.com/i/490885
April 2015 • The PCB Magazine 25 in layers not requiring for routing in the design (Figure 4). Multek has made extensive investments since 2004 in the invention and production scaling of customers' ELIC requirements, with HIGH-DENSITy INTERCONNECTS: ENABLING THE INTELLIGENCE OF THINGS continues FeAture Figure 1: HDI: 2+n+2, stacked microvias, buried through-hole via. Figure 3: elIC sequential lamination steps to form solid copper stacked microvias. Figure 2: HDI: 2+n+2 staggered microvias, buried through-hole via.