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28 The PCB Magazine • April 2015 and average total thickness of 0.062 inches. Current mobile communication products such as Smart phones have HDI technology can be up to 14 layers, ELIC technology, 50 micron L/S inner layers, 37.5 micron L/S outer layers and total PCB thickness from 0.060 to 0.047 inches, based on core and pre-preg thickness options. Smartphones presently have the function- ality of a personal computing, high-resolution camera and video, transmission and receipt of data, and, yes, phone capabilities. The smart- phone is now the hub of personal and device connection. The HDI Building Blocks for Smart, Connected Products HDI PCBs and HDI-FPC hybrid platforms are key building blocks in multiple applications across automotive, medical, data & storage, mo- bile communication and wearable technologies. There are multiple benefits and advantage of HDI-RFPC hybrids that includes: a) A single printed circuit with repeatable, reliable, high density interconnects. b) System cost-saving resulting from component integration (eliminates connectors and other components). HIGH-DENSITy INTERCONNECTS: ENABLING THE INTELLIGENCE OF THINGS continues Figure 6: Stack-up of actual rFPCs using HDI technology in data storage application. FeAture