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40 The PCB Design Magazine • April 2015 PCB007 News Highlights Schmoll Keeping an Eye on the Future— and on LDI In this interview, Thomas Kunz, who has been at the helm of Schmoll Maschinen as president since 1993, discusses the company's lengthy history in mechanical engineering (more than 70 years!), current global scope, and what he sees as a steady progression in directions that make the most sense to customers, which include laser direct imaging. IPC Volunteers Recognized at APEX IPC presented Committee Leadership, Distin- guished Committee Service and Special Recogni- tion awards at IPC APEX EXPO® at the San Diego Convention Center in February. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service. IPC Opens Latest Statistical Programs IPC's global statistical programs for the laminate, solder, process consumables and assembly equip- ment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC-member companies as a benefit of membership. Shennan Circuit Gets Top Supplier Award "Having a network of strong-performing suppli- ers that share our commitment to delivering ex- ceptional quality and cost-effective solutions is essential to meeting our customers' needs," said Wayne Flory, vice president, material & supply for Rockwell Collins. "Shennan has been a strong- performing supplier since we started working with the company nearly ten years ago." HDI Leads Rigid PCB Growth in 2014 High-density interconnect was still a main engine of growth in rigid PCB field in 2014, and is ex- pected to maintain the momentum in 2015. As mobile phone screens become larger, PCBs for mobile phones have to react accordingly. To en- sure light weight and thinness of mobile phones, the demand for more advanced anylayer HDI in- creases tremendously. How 3D Printing will Impact PCB Fabrication In the near future, we will enter an era where elec- tronic devices are printed, rather than assembled. They will be fabricated layer-by-layer as a single object, rather than assembled from separate me- chanical, electrical, and optical parts. This article describes the implications that 3D printing will have on PCB manufacturing. Material Witness: Low-Flow Prepregs— Defining the Beast! The term "low flow" should make sense to both suppliers and users of the products. A low-flow prepreg flows sufficiently to wet out and adhere to bonding surfaces and to fill innerlayer copper details, but does not flow so much as to fill in cut- out areas in a heat sink or run unevenly out of the interface between rigid and flexible elements of a rigid-flex PWB. Raising a Unified Voice for an Advanced Manufacturing Economy The electronics manufacturing industry is an im- portant sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry, as well as the prosperity and welfare of billions of people. Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the impor- tance of the alignment of global standardization processes, especially for Asia. FlexTech Honors Flex Electronics Firms FlexTech Alliance awarded Thin Film Electronics, Vitex Systems and Pacific Northwest National Lab- oratories (PNNL), and California Polytechnic Insti- tute's Graphic Communication Department with the 7th annual FLEXI Awards for Innovation, R&D, and Leadership in Education awards, respectively. 40 The PCB Design Magazine • April 2015

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