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VISUALIZE THE INNER STRUCTURE WITH BF-Xl in-line 30 automated X-ray inspection system for PCBs Planar Computed Tomography (PCT) captures I 00 slices through the board, solder joints, and components, analyzing their internal structures for a crue volumetric repres entation of 3 D imaging. Automated inspection technology perfectly separates the top and bottom of the PCB, corrects position misalignment and warpage, and measures and classifies defects, creating 3D data r the entire sample. Saki's BF-X3 inspects and measures the solder joint structures of BGAs, LGAs, QFNs, plated through-holes, leaded ICs, and PoP lamination in 3D with high definition. SAKI'S ADVANTAGES: SAKI'S 30 INSPECTION • • I True cubic volumetric measurement • State-of-the-art inspection of non-wetting and head-in-pillow solder joints • Inspection algorithms based on 3D volume measurements and solder profile • Best-in-class Cpk and gage repeatability and reproducibility volume measurement • On-the-fly 30 reconstruction and volume measurement for each solder joint • Clear, sharp image quality with perfect slice separation • Maximum test coverage with lowest escape and false cal I rates

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