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May 2015 • SMT Magazine 15 Considering the extreme drive for miniaturiza- tion and added functionality, it is not surprising that the 01005 packages are becoming increas- ingly used despite the limited electrical values currently available, the relatively high compo- nent cost and the difficulties in the production processes. With reduced component spacing from 0.2 mm–0.1 mm, up to 35% area savings can be achieved (Figures 1,2) and by moving from 0402 to 01005 with 150 µm component spacing a 74% (Figure 3) can be achieved. To understand what technologies and ca- pabilities that are required going forward it is important to have a well established roadmap process that captures product and industry re- quirements and availability of components. PCB and materials are equally important. The technology roadmap process typically has four major process steps and each of them is equally important: • Technology requirement • Technology roadmap • Technology development • Technology deployment mINIaTURIzaTION WITH THE HELP OF REDUCED COmPONENT-TO-COmPONENT SPaCING continues Feature figure 1: 01005 with component-to-component spacing between 100–200 µm. Figure 3: Area saving by using 01005 instead of 0201 and 0402. figure 2: 0201 with component-to-component spacing between 100–200 µm.