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May 2015 • SMT Magazine 39 The next parameter that was investigated was how the print result varied with the pressure of the squeegees against the stencil. In this case, all the printing parameters were fixed except for the squeegee pressure, the data was analyzed, and the spread of the print errors was plotted against dif- ferent acceptance levels of the SPI (from ±10% to ±100%), as depicted in Figure 8. SOLDER PaSTE PRINTING: QUaLITy aSSURaNCE mETHODOLOGy continues Feature figure 7: results for how the amount of successful deposits varies with the squeegee speed and internal print-head pressure. figure 8: results for how the paste misprints vary with the squeegee pressure.