Issue link: https://iconnect007.uberflip.com/i/520182
June 2015 • SMT Magazine 21 not the case, Silicon Nails will not generate the test properly. The user must then modify the li- brary to change the properties of non-accessible pins so that the Silicon Nails test can be gener- ated. Similar modifications have to be made for every test that the system is unable to generate automatically. In contrast, writing test scripts can be straightforward with specialist external bound- ary-scan tools, especially when using a high- level device-centric language. The system au- tomatically generates test vectors at runtime that meet the stated requirements. Moreover, users can benefit from the increased capabili- ties of specialist equipment, such as advanced connection tests that are able to identify faults that more basic tests cannot detect, and can pinpoint the causes of any faults extremely ac- curately. Tests such as shorts, opens, pull-ups, pull-downs and interconnection testing can be performed automatically. By combining specialist boundary-scan ca- pabilities with ICT, users can take advantage of state-of-the-art boundary-scan functionality, such as automatic generation of tests for non boundary-scan devices. Test scripts are easy to write, particularly when using a high-level device-centric language that allows the test de- scription to be abstracted from the detail of gen- erating test vectors. Making changes to the executing boundary- scan tests is as simple as changing the under- lying scripting language rather than wading through millions of lines of test vectors: Pinout and board netlist changes can be easily inte- grated into the test platform without making TeST MATCH—PARTneRInG SPeCIALIST BOunDARy-SCAn WITH ICT continues figure 2: Advanced connection tests can identify and pinpoint the possible physical locations of faults. Feature