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4 SMT Magazine • June 2015 This month, feature contributors from Keysight Technologies, XJTAG, Göpel and Sonoscan shed light on the trends and challenges of test and inspection. High-Density Interconnect and embedded Board Test by Mark Lau Test Match-Partnering Specialist Boundary-Scan with ICT by Robert Thompson In-line Solder Penetration Testing with 3D X-ray Inspection by Andreas Türk Acoustic Surface Flatness of Components and Boards by Tom Adams Inspection: the Last Line of Defense An Interview with Viscom's Guido Bornemann 8 18 26 32 40 Featured Content June 2015 test & InspectIon m a g a z i n E

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