Issue link: https://iconnect007.uberflip.com/i/520182
42 SMT Magazine • June 2015 Bornemann: Yes, it basically depends on the de- sign. If you have small chip components in the shadows of big ones, 3D is limited because you have shadowing. It's good to be able to switch back to 2D. Glass 2D is offering a higher resolu- tion, working on the real images, and speed, of course. Matties: So when you first acquire the data for testing, how do you do that? Bornemann: We are working based on any kind of data where we need placement data, rota- tion and so on. So it could be Gerber data, it could be cut data, whatever they have. We are algorithm-based, so we import this into our software and then we assign our algo- rithms to their components and run the inspection. It's completely algorithm-based. Matties: do you offer x-ray so- lutions also? Bornemann: We offer X-ray for both. Matties: So you can cover them from start to fin- ish in the process of an inspection. i know head-in- pillow is a large issue, and with your x-ray technol- ogy you can at least prevent potentially defective products from being shipped. Bornemann: Head-in-pillow is one of the big is- sues and here we are working with very high- resolution systems. We are just launching our flat-panel, inline X-ray system, and with this we are able to cover the head-in-pillow issue. Matties: By the time the product gets to your pro- cess, it's already built; it's done. You're just prevent- ing your customers from sending out a potentially bad board. You don't actually have them improve their process, do you? Bornemann: When you do the inspection at the end of the line it's basically too late, but since we have inspection solutions for every test, whether it be an SPI, pre-reflow, post-re- flow, AOI, or X-ray, we are communicating all along the line. We have installed a true yield, which is our feature to communicate between the machines, even with some pick-and-place machines and with some printers, in order to give customers information about the process, where the defects might happen, and how to countermeasure it. Usually it happens either on the printing or in the oven. So if they are using an SPI, 3D SPI glass, and then the 3D AXI, we can help them determine when that occurs. Matties: catching it at that early stage would save them a lot of capacity, time, and re- source overall. how many cus- tomers have adopted that strat- egy? Bornemann: It's mainly the automotive customers who are really spending a lot on in- spection for nearly every test. That's really a life-or-death situ- ation. If an airbag is broken or the anti-lock braking system is not working, it could be life or death. Automotive companies must make sure that every single defect is found. To find 80% of the defects is not really difficult, but it's also not enough. It might be okay for low- end products, but automotive must really find every single defect. Even if their process is fully optimized, they still need the inspection. Matties: that's really interesting because when you look at inspection as a stand-alone process, it doesn't add value at all. it only adds cost, but the cost of failure is so catastrophic that you have to do it. Bornemann: That basically was the case with AOI 10 years ago. With no value-add, people thought they didn't need it. In the end, they were forced by their customers to test and that's how AOI became a standard in today's lines. InSPeCTIOn: THe LAST LIne OF DeFenSe continues If an airbag is broken or the anti-lock braking system is not working, it could be life or death. automotive companies must make sure that every single defect is found. to find 80% of the defects is not really difficult, but it's also not enough. " " Feature IntervIew