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June 2015 • SMT Magazine 61 eVenT ReVIeW: (eMPS-6) continues artICle contamination as micrograms/per sq cm NaCl equivalent. A new test method, process ionic contamination test (PICT) was discussed in de- tail, including the equipment and the criteria for specimens to pass or fail. The PICT test is described as an inexpensive fast and easy test to control an assembly process accurately. Cathy Barnes, quality manager at Spur Elec- tron Ltd, Havant, UK, then described the chal- lenges and advantages of an independent labo- ratory as provider of expertise to the space and defense industries. The services of Spur include engineering and component procurement; they have an advanced manufacturing capability and an extensive laboratory. One of the greatest challenges of an independent laboratory is how information gained from failure investigations can be used to the benefit of the space industry (due to non-disclosure agreements). However, analyses and verification programmes conduct- ed for ESA have revealed many problem areas related to component and solder joint failures that can be shared with the entire space com- munity. Problems related to the design and as- sembly of electronic circuits have been relayed to ESA and Eurospace in order to enhance rel- evant standards in the ECSS series. Barnes end- ed her talk by showing numerous unusual fail- ures, some of which were caused by tin whisker growths. The results of a tin whisker growth study using a standard accelerated environmental test following JESD22-A121A was described by Dimas J. Morilla of Alter Technology, Seville, Spain. This is a JEDEC test designed to assess the susceptibility of commercial tin plated com- Figure 2: installation of components on a spacecraft PcB by hot air reflow [1] .