PCB007 Magazine

June 2015 • The PCB Magazine 63 Figure 4: Process steps for making an air gap laminate and photomicrographs of the material both before and after lamination. Figure 3: a comparison of the material properties of the new stretchable thermosetting resin and PEn. NOVEL HIGH-PERFORMANCE SUBSTRATE FOR STRETCHABLE ELECTRONICS continues FeAtuRe

• Cover
• Featured Content — Flexible, Stretchable and Wearable
• Contents
• Feature Column — Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
• Feature — A High-Reliability, Stress-free Copper Deposit for FPC, Polyimide and Rigid-flex
• Feature — Enabling Smart Wearable Technology: Flexible, Stretchable Interconnect
• Feature — Flexible and Stretchable Circuit Technologies for Space Applications
• Short — Sign up For SMART Group's 2015 European Conference
• Feature — Flexible Circuit Materials for High-Temperature Applications
• Short — Stanford Creates Super-efficient Light-based Computers
• Feature — Staying Current: High-Speed UV Laser Micromachining and Flex Circuit Trends
• Feature — Novel High-Performance Substrate for Stretchable Electronics
• Short — Ford Opens IP Portfolio to Fuel EV Industry Growth
• EIN Market Highlights
• Feature Column — Flex and Rigid-Flex Circuit Testing: Challenges & Solutions
• Video Interview — IPC Standar 6013 Heading to Revision D
• PCB007 Supplier/New Product Highlights
• Feature Column — The Flex-to-Fit Approach
• Mil/Aero007 Highlights
• Feature Column — Wearable Technology and Flexible Circuits
• Video Interview — Automation in Probe Testing Provides Throughput Benefits
• Column — Best Practices 101, Part 8: Poka-Yoke
• Top Ten Recent Highlights from PCB007
• Events Calendar
• Advertiser Index and Masthead