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16 The PCB Magazine • June 2015 ditives and similar coupon construction. The comparison is shown in Figure 8. Note that the historical IST data was performed at a lower pre- conditioning temperature of 230°C. It is gener- ally accepted that preconditioning at higher temperatures is a more critical test with regard to IST failure. The additives had no negative effects on in- terconnect reliability of the electroless copper deposit when compared to historical data of an Table 1. IST GM40001a results. Figure 6: Examples of IST sense circuit failures identified by cross section evaluation as copper plating cracks. A HIGH-RELIABILITY, STRESS-FREE COPPER DEPOSIT FOR FPC, POLYIMIDE AND RIGID-FLEx continues FeAtuRe