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34 SMT Magazine • August 2015 Conclusion There is a set of IPC specifications that drives industry compliance. The problem is that these tests do not provide the resolution needed to measure highly dense devices using BTCs. This creates a totally new environment that calls for improved test methods and specifications to quantify the issues and problems associ- ated with residues under BTCs. The research is driving toward a bet- ter model for making accurate risk assessments. OEMs currently count on CMs for qualifying and vali- dating process conditions. The problem is that the CM war- ranty does not meet OEM war- ranty expectations. How does the OEM obtain the data need- ed to satisfy the CM warranty and consumer expectations? If these expectations can be inte- grated, the OEM now has the knowledge to make accurate assessments of their product toward consumer expectations. Quality and reliability engineers need to capture the right variables that allow them to meet their quality objec- tives. When people have horizons of 10–25 years, there is a gap in knowing whether or not you are clean enough. The problem is that the stakeholder is the OEM, not the CM who is making the decision on materials and process parameters. To achieve this level of granularity, the test- ing methods in work have the potential to pro- vide better resolution for answering these ques- tions. Is the research method perfected today? No, but that is why you learn from the data findings, confirm your assumptions and design follow-on research to move from a hypothetical position to theory. The whole goal is confirm our theorems in an effort to improve standards. The flux study confirmed the old saying "If you are going to do a job, do it right or not at all." While there was substantial variation in the data, this preliminary study shows that the electrical resistance underneath components can be measured using voltages that are repre- sentative of modern circuits and environmental conditions. This is not extreme. The species testing provides needed insight into quantifying ionic levels for each ion that can lead to a drop in resistance. Follow on study is needed to gain a clearer understanding of the method for isolating specific ions. By doing so, an accurate assessment of levels can be correlated to electric field. SMT **Originally presented by KYZEN at SMTA ICSR. References 1. Bryzek J., "Living Con- nected Through a Trillion Sensors," SMTA International Conference on Soldering and Reliability. San Jose, Califor- nia, Nov. 2014. 2. Ismail, S, Malone, M.S., & Yuri, V.G., "Exponential Organizations: Why new or- ganizations are ten times bet- ter, faster and cheaper than others," Singularity University, Dec. 2014. 3. McMeen, M., "Complex Elec- tronic Assembly Cleanliness Requirements," IPC/SMTA High Performance Cleaning Confer- ence, Schaumberg, Illinois, Nov. 2014. 4. IPC-CH-65B: "Guidelines for Cleaning of Printed Boards and Assemblies," IPC Hardware, July 1011. FeAture HOW CLEAN IS CLEAN ENOuGH TO ACHIEvE RELIABLE ELECTRONIC HARDWARE? continues Mike Bixenman is cTo at KYZen corporation. David Lober is a chemist at KYZen corporation. Mark McMeen is vice president of engineering/manufacturing at STi Electronics inc. Jason Tynes is manufacturing engineer at STi Electronics inc. Is the research method perfected today? no, but that is why you learn from the data findings, confirm your assumptions and design follow-on research to move from a hypothetical position to theory. " "