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September 2015 • SMT Magazine 81 Analyzing Component Finishes and Solder Al- loys to Determine Tin (Sn) – Lead (Pb) Content, March 2010. 8. MIL-STD 1580B, Change 2, Dated 15 November 2010, Requirement 9: Detailed Re- quirements for Prohibited Materials Analysis of External Package Plating Materials (and/or In- coming Inspection of External Package Plating Materials) Using X-Ray Fluorescence (XRF), and Prohibited Materials Analysis of Internal Pack- age Materials Using Energy Dispersive Spectros- copy (EDS). 9. John Stephens, SAS, TAS, EWS, "Sn Whis- kers and Mitigation Techniques," Goleta CA, 18 June, 2008. 10. Email correspondence between David Pinsky (Raytheon), and David Hillman (Rock- well Collins), dated 11 April 2013 12. Masanobu Tsujimoto, "Study of Tin Whisker Inhibiting Systems Controlling Cop- per Substrate Roughness Controlling the Tin Deposit Crystal Structure," 12 November 2013, 7th IPC Symposium on Tin Whiskers. 12. David M. Lee and Lesly A. Pinol, Ph.D., "Effects of Tin and Copper Nano-texturization on Tin Whisker Formation." 13. Sony Matthew, Weiqiang Wang, Michael Osterman, and Michael Pecht, "Assessment of Solder Dipping as a Tin Whisker Mitigation Strategy," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 1, No. 6, June 2011. figure 11: Scatter plot showing lead dimensions versus mitigation status. thomas Hester is principal multi-disciplined engineer, component engineering, Hardware engineering center, Space and airborne Systems, at raytheon company. David pinsky is a engineering fellow at raytheon company. tIN WHIsKer seLF-mItIGAtION IN surFACe mOuNt COmpONeNts continues ArtiCle