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September 2015 • SMT Magazine 77 excluded from consideration in the analysis, and beige for locations where the solder joints were manually re-worked prior to XRF measurement. C. SEM-EDS Quantitative Analysis Data Typical of Design 2 SEM/EDS (Energy Dispersive X-ray Spectros- copy) analysis of a few selected components leads was performed with a SEM JSM (JEOL)- 6460 equipped with an IncaPentaFETx3 de- tector and software analyzer. The quantitative analysis data was adjusted for accuracy using a 97wt%Sn-3wt%Pb materials standard issued by Matrix Metrologies, as can be seen in Figure 9. The test procedure was according to the MIL- STD-1580, Requirement 9 [8] . ArtiCle tIN WHIsKer seLF-mItIGAtION IN surFACe mOuNt COmpONeNts continues figure 8: Typical xrf quantitative analysis of tin weight% in solder terminations for McM's serial number 7–11, 14, 26, and 27. figure 9: SeM-eDS Data for 97 Wt% tin standard.