SMT007 Magazine

Visit www.ipc.org/events for IPC Calendar October 13 IPC Conference on Government Regulation Essen, Germany Discussion with international experts on regulatory issues October 13–15 IPC Europe Forum: Innovation for Reliability Essen, Germany Practical applications for meeting reliability challenges like tin whiskers, with special focus on military aerospace and automotive sectors October 26–27 IPC Technical Education Minneapolis, MN, USA Professional development courses for engineering staff and managers: • DFX-Design For Excellence (DFM, DFA, DFR and more) • Best Practices in Assembly • Advanced PCB Troubleshooting • SMT Problem Solving October 28–30 IPC Flexible Circuits-HDI Conference Minneapolis, MN, USA Presentations will address Flex and HDI challenges in methodology, materials, and technology. November 2–6 IPC EMS Program Management Training and Certification Chicago, IL, USA November 4 PCB Carolina 2015 Raleigh, NC, USA November 10–13 productronica Munich, Germany December 2–3 IPC Technical Education Raleigh, NC, USA Professional development courses for engineering staff and managers: • DFX-Design For Excellence (DFM, DFA, DFR and more) • Best Practices in Assembly • Advanced PCB Troubleshooting • SMT Problem Solving December 2–4 International Printed Circuit and APEX South China Fair (HKPCA & IPC Show) Shenzhen, China December 7–11 IPC EMS Program Management Training & Certification San Jose, CA, USA ADDRESS challenges associated with flexible circuits and HDI technology To help you make optimal choices for meeting customer reliability requirements, IPC has gathered leading subject matter experts to share their knowledge and experiences with you in an exciting three-day forum. • Battelle • Flextronics • Multek-Flextronics • SAIC • DuPont • Insulectro • Orbotech • TTM Technologies • eSurface • Intrinsiq Materials • RBP Chemical Technology For more information, visit www.ipc.org/flex-hdi QUESTIONS? Contact IPC Director of Education at AnneMarieMulvihill@ipc.org October 28–30, 2015 • Minneapolis, Minnesota IPC Flexible Circuits – HDI Forum

• Cover
• Feature Articles — Cycle Time Reduction
• Table of Contents
• Column — The Need for Speed
• Feature — Value Stream Mapping: Operationalizing Lean Manufacturing
• Feature Interview — Choosing the Right Component to Reduce Cycle Times
• Feature Column — Reducing Print Cycle Time
• Short — Darwin on a Chip
• Feature Interview — Cycle Time Reduction in the Eye of AOI
• EIN Market Highlights
• Feature Interview — Reducing Cycle Times with Innovative Bonding Solutions
• Feature — Technologies to Enable Quick-Turn PCB Assemblies
• Feature Interview — Process Improvements for Cycle Time Reduction
• Short — Nanostructures for Contactless Control
• Feature Column — Cycle Time Reduction with WORK, Part I
• MilAero007 Highlights
• Feature Interview — Is Automation the Answer to Cycle Time Reduction?
• Column — Gold Embrittlement Mitigation: Understanding the New J-STD-001 Requirements
• Short — A Fast Cell Sorter Shrinks to Cell Phone Size
• Supply Line Highlights
• Feature Interview — Inspection Innovations to Reduce Cycle Time
• Short — Permanent Data Storage with Light
• Column — Selecting a Reflow Oven, Part 3
• Top Ten Recent Highlights from SMT007
• Events Calendar
• Advertiser Index and Masthead