Design007 Magazine

Visit www.ipc.org/events for IPC Calendar October 13 IPC Conference on Government Regulation Essen, Germany Discussion with international experts on regulatory issues October 13–15 IPC Europe Forum: Innovation for Reliability Essen, Germany Practical applications for meeting reliability challenges like tin whiskers, with special focus on military aerospace and automotive sectors October 26–27 IPC Technical Education Minneapolis, MN, USA Professional development courses for engineering staff and managers: • DFX-Design For Excellence (DFM, DFA, DFR and more) • Best Practices in Assembly • Advanced PCB Troubleshooting • SMT Problem Solving October 28–30 IPC Flexible Circuits-HDI Conference Minneapolis, MN, USA Presentations will address Flex and HDI challenges in methodology, materials, and technology. November 2–6 IPC EMS Program Management Training and Certification Chicago, IL, USA November 4 PCB Carolina 2015 Raleigh, NC, USA November 10–13 productronica Munich, Germany December 2–3 IPC Technical Education Raleigh, NC, USA Professional development courses for engineering staff and managers: • DFX-Design For Excellence (DFM, DFA, DFR and more) • Best Practices in Assembly • Advanced PCB Troubleshooting • SMT Problem Solving December 2–4 International Printed Circuit and APEX South China Fair (HKPCA & IPC Show) Shenzhen, China December 7–11 IPC EMS Program Management Training & Certification San Jose, CA, USA ADDRESS challenges associated with flexible circuits and HDI technology To help you make optimal choices for meeting customer reliability requirements, IPC has gathered leading subject matter experts to share their knowledge and experiences with you in an exciting three-day forum. • Battelle • Flextronics • Multek-Flextronics • SAIC • DuPont • Insulectro • Orbotech • TTM Technologies • eSurface • Intrinsiq Materials • RBP Chemical Technology For more information, visit www.ipc.org/flex-hdi QUESTIONS? Contact IPC Director of Education at AnneMarieMulvihill@ipc.org October 28–30, 2015 • Minneapolis, Minnesota IPC Flexible Circuits – HDI Forum

• Cover
• Feature Articles — Accelerating the PCB Design Cycle
• Table of Contents
• Column — Squeezing Seconds Out of the Design Cycle
• Feature — Don't Be Held Hostage by Design Cycle Time
• Short — Whelen Engineering: The First New Captive in Decades?
• Feature — Accelerating the Design Cycle: Moving from Discipline-Centric to Product-Centric Design
• Short — Discovery about New Battery Overturns Decades of False Assumptions
• Feature — The Readers Speak: Tips on Accelerating Your Design Cycle
• Short — Superconductivity Trained to Promote Magnetization
• PCB007 Highlights
• Feature Column — Speeding up the Design Cycle: 10 Things to Remember
• Column — Stackup Planning, Part 4
• Short — Big Range of Behaviors for Tiny Graphene Pores
• Column — Avoiding the Black Spot of Negative Expectations
• Short — Back to the Future: Science Fiction Turns Science Fact
• Column — Impact of Final Plated Finish on PCB Loss
• Short — How Leaky is Your Device?
• MilAero007 Highlights
• Article — The Gerber Guide, Chapter 3
• Article — Analyzing Condensation and Evaporation in Headlights with Thermal Simulation
• Short — Energy Out of Thin Air
• Top Ten Recent Highlights from PCBDesign007
• Events Calendar
• Advertiser Index and Masthead