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36 SMT Magazine • December 2015 Solder Paste Stencil Design for optimal QFn yield and reliability over the past 15 years, the imple- mentation of the QFn/BTC pack- age has garnered a great amount of attention due to the assembly and inspection process challenges asso- ciated with the package. The difference in solder application parameters between the center pad and the perimeter pads is discussed. A review of the opportunities and Processes for Printed electronics in the first part of this five-part article series, Happy Holden gives a brief background on printed elec- tronics, as well as presents key technologies that are being employed for pE production. Advanced Printing for microelectronic Packaging The concept of dispensing a wide range of materials in three dimen- sions presents a potential change in electronic packaging. This arti- cle covers the concept of combin- ing dispensing technologies on a single platform to build integrated and monolithic electronic structural circuits. reliability Study of bottom Terminated components This article series discusses bottom terminated components (bTC), and the stress and strain on these components when it comes to solder joints. in Part 1, the authors look at the impact of large voids at the thermal pads of bTC components and their impact on solder joint reliability. How to Streamline Pcb Thermal Design Thermal issues with a PCB design are mostly determined during the component selection and lay- out phases. John Parry of Mentor Graphics discusses how addressing thermal issues early in pCb design, starting at the system or enclosure level, can help streamline the entire process. enhancing Thermal Performance in embedded computing for ruggedized military and Avionics Applications Embedded computing systems used in many mili- tary and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This article outlines a series of passive thermal improvements that are easily integrated into legacy systems and can provide a 3-4x increase in dissipated power. benefits of Soldering with Vacuum Profiles requirements for void-free solder joints are con- tinuously increasing in the field of electronics manufacturing, bringing new challenges that are evolving on a daily basis due to the relentless in- troduction of new variants of so-called bottom- terminated components (bTCs). nePcon china Showcases Latest manufacturing Tech in Asia Considered Asia's biggest, most influ- ential SMT and electronics manufac- turing event, nEpCon China 2015 at- tracted over 450 leading brands from 22 countries, who showcased the lat- est electronics manufacturing technologies and products across an exhibition area of 25,000 sqm. Pad cratering Susceptibility Testing with Acoustic emission pad cratering is difficult to detect by monitoring electric resistance since it initiates before an elec- trical failure occurs. This article presents the results of pad cratering susceptibility of laminates using the acoustic emission method under four-point bend and compares the aE results to the pad-sol- der level testing results. emI-caused eoS Sources in Automated equipment Electrical overstress causes damage to sensitive components, including latent damage. a signifi- cant source of EoS is high-frequency noise in au- tomated manufacturing equipment. This article analyses sources of such noise, how it affects com- ponents and how to mitigate this problem. 36 SMT Magazine • December 2015 SmT magazine's best of 2015 ARTiClES

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